Automotive CIS backend may incorporate RW technology
Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry sources.
Taiwan’s CIS backend specialist Tong Hsing Electronic Industries is mulling incorporating its wafer reconstruction technology into automotive CIS production looking to effectively shorten the verification time for such products, the sources said.
Tong Hsing has landed big BGA packaging orders for automotive CIS from Sony and OminiVision, both of whom are actively deepening their deployments in the segment after gaining solid presence in the handset CIS sector, noted the sources.
The company is striving to boost its combined revenue ratio to over 50% in 2022 for automotive applications including CIS, ceramic substrates for LED lighting chips, while further strengthening its capability for processing power modules and MCUs that remain in tight supply, the sources continued.
Actually, the sources stressed, the growth momentum for automotive CIS and MCUs is mainly bolstered by the mounting penetration of ADAS (advanced driver assistance system) solutions, which have become a standard feature for new ICE (internal combustion engine) cars, hybrid vehicles and BEVs (battery electric vehicles).
Weakening demand for consumer devices is driving many ICT supply chain players to exert more efforts on developing automotive electronics to meet the booming demand, the sources noted, adding this may accelerate qualitative changes to automotive ecosystems.